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Head-to-Head Comparison of Immersion and Cold Plate Cooling Technologies

Key Technical Comparisons

Parameter Immersion Cooling VS Cold Plate Cooling

Coolant 

Type

Dielectric Fluids (Fluorocarbon/Mineral Oil)

Water-based Solutions (e.g., Ethylene Glycol-Water)

PUE

1.03–1.08

1.15–1.25

Max. Rack Power Density

100kW+

50–60kW

Retrofit Cost

$$$$ (Custom Tanks & Infrastructure)

$$ (Component-level Modification)

O&M Complexity

High (Fluid Handling Required)

Medium (Seal Maintenance)

Acoustic Noise

<50 dB

65–75 dB*

Leakage Risk

Near Zero (Sealed Environment)

Low (DLC Connectors <10⁻⁶ mbar·L/s)

Typical Heat Removal

100% (Full Immersion)

~70% (CPU/GPU Focus)

Note: Noise levels for cold plate systems depend on residual fan usage for non-coolant-covered components.


Terminology Clarification

  • PUE‌ (Power Usage Effectiveness): Total Facility Power / IT Equipment Power

  • DLC Connectors‌: Dry-break, Leak-proof Couplings

  • Ethylene Glycol-Water‌: Standard mixture ratio 60:40 for freeze/boil protection (-40°C to 130°C)

Industry References

  • Immersion Adoption‌: Microsoft’s Project Natick (Submarine Datacenter)

  • Cold Plate Standards‌: Open Compute Project (OCP) Cold Plate Specification v2.0


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